H - Electricity
01
L
356/146
H01L 23/48 (2006.01) H01L 23/13 (2006.01) H01L 23/495 (2006.01) H05K 1/18 (2006.01) H05K 1/02 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2012338
ABSTRACT OF THE DISCLOSURE A chip carrier for mounting semiconductor device chips thereon. The chip carrier includes a flexible tape and metal wires formed on the surface of the flexible tape. Each of the metal wires includes an inner lead portion and the inner lead portions are supported by the flexible tape. The flexible tape is formed with an opening in an area thereof inside the forward ends of the inner lead portions.
Kamimura Masaru
Ohtani Kenichi
Furukawa Denki Kogyo Kabushiki Kaisha
Kamimura Masaru
Macrae & Co.
Ohtani Kenichi
Seiko Epson Corporation
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