Chip carrier

H - Electricity – 05 – K

Patent

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Details

356/22

H05K 3/30 (2006.01) H01L 23/13 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2026214

ABSTRACT A chip carrier for mounting a semiconductor device chip (6) wherein a predetermined metal wiring (1) is formed on the surface of a flexible film member (2), and wherein the film member (2), in a first region including inner lead portions (1a) of the metal wiring (1) and surrounding the region on which the chip (6) is mounted, has a thickness less than the second thickness of the region surrounding the first region.

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