H - Electricity
05
K
356/22
H05K 3/30 (2006.01) H01L 23/13 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H05K 1/02 (2006.01) H05K 1/18 (2006.01)
Patent
CA 2026214
ABSTRACT A chip carrier for mounting a semiconductor device chip (6) wherein a predetermined metal wiring (1) is formed on the surface of a flexible film member (2), and wherein the film member (2), in a first region including inner lead portions (1a) of the metal wiring (1) and surrounding the region on which the chip (6) is mounted, has a thickness less than the second thickness of the region surrounding the first region.
Furukawa Denki Kogyo Kabushiki Kaisha
Macrae & Co.
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