Chip carrier for a chip module and method of manufacturing...

Details Chip carrier for a chip module and method of manufacturing... Chip carrier for a chip module and method of manufacturing...

H - Electricity

01

L

H01L 23/498 (2006.01) G06K 19/077 (2006.01) H01L 21/48 (2006.01) H01L 23/64 (2006.01)

Patent

CA 2370878

The invention relates to a chip carrier for manufacturing a chip module (18), with a substrate and connection leads arranged on the substrate, wherein the connection leads are designed like stripes and extend parallel over the substrate, and wherein the connection leads consist of electrically conductive connection strands (12, 13) placed on the substrate, and the substrate is formed by a carrier film (11).

L'invention concerne un porte-puce utilisé pour la constitution d'un module puce (18), qui comporte un substrat et des conducteurs de raccordement disposés sur ce substrat. Les conducteurs de raccordement se présentent sous la forme de bandes et s'étendent parallèlement sur le substrat. Ces connecteurs de raccordement sont constitués de rubans de connexion (12, 13) électroconducteurs, appliqués sur le substrat, et le substrat est formé par un film support (11).

Affiliated with

Also associated with

Rating

Chip carrier for a chip module and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip carrier for a chip module and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip carrier for a chip module and method of manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2072844