Chip carrier mounting arrangement

Details Chip carrier mounting arrangement Chip carrier mounting arrangement

H - Electricity

05

K

356/9

H05K 1/18 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1222328

CHIP CARRIER MOUNTING ARRANGEMENT ABSTRACT OF THE DISCLOSURE A leadless ceramic chip carrier for surface mounting on an epoxy printed circuit board is shown featuring an arrangement for relieving the thermally induced stress by progressively lengthening the attach- ing solder pillars as the distance from the center line of the ceramic chip increases to avoid exceeding the elastic limits of the solder.

482192

Affiliated with

Also associated with

Rating

Chip carrier mounting arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Chip carrier mounting arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip carrier mounting arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1247748