H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/143, 356/178
H01L 23/552 (2006.01) H01L 23/053 (2006.01) H01L 23/12 (2006.01) H01L 23/16 (2006.01) H01L 23/556 (2006.01)
Patent
CA 2021682
In a chip-carrier provided with a chip-carrier substrate, a chip-carrier cover and an IC chip, said IC chip being arranged at a distance from a circuit surface of the IC chip being directed toward the chip-carrier substrate, an .alpha.-ray shielding film made of film material containing few radioactive elements, and adhered to a surface of the chip-carrier substrate facing the IC chip or to the circuit surface of the IC chip is provided for protecting the IC chip from soft errors caused by .alpha.-rays.
Tsuji Mutsuo
Yamaguchi Yukio
Corporation Nec
G. Ronald Bell & Associates
LandOfFree
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