H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/12 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01)
Patent
CA 2126121
A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.
'invention est un support de puce constitué d'un substrat et d'au moins une puce de semi-conducteur montée en configuration inversée sans fil, au moyen de globules de soudure, sur une zone du substrat comportant des circuits. Les globules de soudure sont encapsulées dans un premier agent d'encapsulation comportant une substance qui contient un composé époxy. De plus, une partie au moins des circuits de la zone comportant des circuits est encapsulée avec un second agent d'encapsulation contenant une substance qui contient un uréthanne; cette substance est choisie de façon que le second agent d'encapsulation ait un module d'élasticité égal à 10 000 livres par pouce carré environ ou moins. En conséquence, le second agent d'encapsulation est exempt de craquelures internes et de craquelures à l'interface avec le premier agent d'encapsulation et ne se décolle pas de la zone comportant des circuits quand le support de puce est soumis à un cycle de traitement thermique.
Chase Alan Walter
Wilson James Warren
International Business Machines Corporation
Saunders Raymond H.
LandOfFree
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