Chip contacts without oxide discontinuities

Details Chip contacts without oxide discontinuities Chip contacts without oxide discontinuities

H - Electricity

01

L

356/140

H01L 23/485 (2006.01) H01L 21/60 (2006.01)

Patent

CA 1277435

Chip Contacts Without Opens Abstract An integrated circuit chip including a first and a higher second surface levels with an abrupt sidewall step transition therebetween, and having a first layer of a first conductive material disposed over the first surface level and over the second surface level, but terminating on the first surface level in a first end portion which extends up to but does not touch the sidewall. This end portion comprises a conductive material which has been converted to an insulator. A second layer of a second conductive material is disposed on top of the first conductive layer with essentially no conductive material conversion to insulator therein adjacent to the abrupt sidewall transition. In a preferred embodiment, the conductive material is an alloy of aluminum and the end portion is aluminum oxide.

570925

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