Chip control inserts with diamond segments

B - Operations – Transporting – 23 – D

Patent

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Details

B23D 11/00 (2006.01) B23B 27/14 (2006.01)

Patent

CA 2085019

ABSTRACT An insert having a cutting segment of a polycrystalline diamond or cubic boron wafered between two layers of a hard metal carbide is bonded into a pocket in a standard insert and machined to form a chip breaker having a clearance surface and expose the cutting edge of polycrystalline material integral with the cutting segment.

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