G - Physics – 09 – F
Patent
G - Physics
09
F
G09F 3/08 (2006.01) H05K 1/02 (2006.01)
Patent
CA 2299976
A surface mounted identification label chip component for a printed circuit board and a method of producing and labeling a printed circuit board where the label chip is made from a piece of printed circuit board material with at least one soldering pad on the underside. An adhesive that is heat resistant when cured is applied to the top of the label chip board material and a paper image carrying layer is placed thereon to absorb some adhesive. The adhesive is cured to attach and make the image layer heat resistant, and the chip identification label is mounted on the printed circuit board along with the other components to be mounted thereon.
LandOfFree
Chip identification label does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chip identification label, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chip identification label will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1749654