Chip identification label

G - Physics – 09 – F

Patent

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Details

G09F 3/08 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2299976

A surface mounted identification label chip component for a printed circuit board and a method of producing and labeling a printed circuit board where the label chip is made from a piece of printed circuit board material with at least one soldering pad on the underside. An adhesive that is heat resistant when cured is applied to the top of the label chip board material and a paper image carrying layer is placed thereon to absorb some adhesive. The adhesive is cured to attach and make the image layer heat resistant, and the chip identification label is mounted on the printed circuit board along with the other components to be mounted thereon.

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