Chip module

Details Chip module Chip module

H - Electricity

01

L

H01L 23/13 (2006.01) H01L 21/60 (2006.01) H01L 23/50 (2006.01) H01L 25/065 (2006.01) H05K 1/18 (2006.01) H05K 13/06 (2006.01)

Patent

CA 2141458

A B S T R A C T 1. Chip module 2.1 It is an object of the invention to furnish a chip module, where the chip module avoids substantially an edge short at the chip. 2.2 According to the invention, the object is resolved by having center point bond pads disposed on the chip outside of the edge, wherein the center point bond pads are connected by bonding wires to the conductor paths of the printed circuit board. 2.3 The invention relates to a chip module, where at least one chip, preferably a memory storage or a processor, are disposed on a printed circuit board. 3. Fig. 1. - 10 -

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