Chip mounting device and chip carrier mounting device

H - Electricity – 01 – L

Patent

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148/59, 26/90, 1

H01L 21/58 (2006.01) B23K 3/06 (2006.01) B23K 35/02 (2006.01) B23K 35/14 (2006.01) H05K 3/32 (2006.01) H05K 3/34 (2006.01) H05K 13/04 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1269596

ABSTRACT A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

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