Chip quartz oscillator and liquid-phase sensor

H - Electricity – 03 – B

Patent

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Details

H03B 5/32 (2006.01) G01N 5/02 (2006.01) H03H 9/05 (2006.01) H03H 9/19 (2006.01)

Patent

CA 2441423

The present invention relates to a chip quartz oscillator. In an embodiment of a chip quartz oscillator S in accordance with the present invention, a quartz oscillator 2, which has a detection electrode 3 on a surface thereof and a non- detection electrode on the other surface thereof, is fixed on a substrate 1, and each of the electrodes is connected electrically to a terminal 4 or 4' on the substrate1. While keeping the non-detection electrode in contact with the substrate 1, the quartz oscillator 2 isfixed on the substrate 1, by flexibly bonding the side-wall 2''' of the quartz oscillator 2 along its circumference to the surface of the substrate 1 by using the elastic bonding agent 5. Thus, the oscillation surface of the quartz oscillator 2 is supported distributively on the substrate 1 in a surface-contacting and non-adhesive manner.

Cette invention concerne un oscillateur à quartz à puces. Dans une forme de réalisation d'un oscillateur à quartz à puces (S) de l'invention, un oscillateur à quartz (2), qui présente une électrode de détection (3) sur une surface et une électrode de non détection sur l'autre surface, est fixée sur un substrat (1), et chaque électrode est reliée électriquement à une borne (4 ou 4') disposée sur le substrat (1). Tout en maintenant l'électrode de non détection en contact avec le substrat (1), l'oscillateur à quartz (2) est fixé sur le substrat (1) par collage souple de sa paroi latérale (2'''), le long de sa circonférence, à la surface du substrat (1) à l'aide d'un liant élastique (5). Ainsi, la surface d'oscillation de l'oscillateur à quartz (2) est bien répartie sur le substrat (1) par contact superficielle et de façon non adhésive.

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