Chip resistant coating composition iii

C - Chemistry – Metallurgy – 08 – G

Patent

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C08G 18/46 (2006.01) C08G 18/10 (2006.01) C08G 18/32 (2006.01) C08G 18/79 (2006.01) C08G 18/80 (2006.01) C08G 18/83 (2006.01)

Patent

CA 1305272

Abstract of the Disclosure This invention is directed to thermosetting coating compositions comprising hydroxy functional urethane modified polyester resin, blocked polyisocyanate crosslinking agent, diol modified blocked diisocyanate and polyamine having at least two amine groups selected from primary and secondary amine groups. The hydroxy functional urethane modified polyester resin is the product of polymerization of lactone monomers in the presence of hydroxy-containing urethane modified polyester precursor (i) having having a number average molecular weight (?n) between about 1,000 and about 10,000, (ii) having a hydroxy number between about 30 and about 300, and (iii) containing between about 1 and about 10 urethane groups per molecule.

540949

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