H - Electricity
01
C
338/25
H01C 17/06 (2006.01) B05D 5/12 (2006.01) H01C 17/00 (2006.01) H01C 17/065 (2006.01)
Patent
CA 1316231
84-4-052-CIP ABSTRACT CHIP RESISTOR Thick film resistors are fabricated for use in hybrid microcircuits by a sequence of steps beginning with the formation of a dielectric substrate on a carrier substrate. The dielectric layer is then baked to provide an appropriate rigidity after which a resistance element is deposited thereon as well as conductive terminals, the subsequent firing of both materials followed by heating of the entire assembly to a point where the adhesive characteristics of the dielectric layer are substantially reduced and the resultant film resistors become separated from the carrier substrate.
592623
Ag Communication Systems Corporation
R. William Wray & Associates
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