Chipboard and method of laminating thin chipboards with...

B - Operations – Transporting – 32 – B

Patent

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Details

154/118, 154/97,

B32B 15/10 (2006.01) B27N 7/00 (2006.01) B32B 15/16 (2006.01)

Patent

CA 1109382

A B S T R A C T The specification describes chipboard having a lamination adhered on the surface thereof by means of an adhesive substance and a method for production thereof. The lamination consists of a sheet metal, preferably sheet aluminum. The method comprises the use of a press including a heated roll and a belt which is kept under tension and is partly looped around the roll. Thin chipboard and a sheet of non-thermoplastic material, preferably printed paper or textile fabric, lying on the side of the chipboard which faces the roll, is guided into the gap between the belt and the roll. At the same time thermoplastic material is introduced between the sheet and the chipboard. The thermo- plastic material is in the form of a film connected securely to the sheet of non-thermoplastic material before the press is reached.

270131

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