C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 22/05 (2006.01) C04B 28/34 (2006.01) C23C 22/07 (2006.01) C23C 22/74 (2006.01)
Patent
CA 2323122
A heat curable bonding composition for providing a coating to a solid substrate comprises water, phosphate ions, borate ions, and aluminum ions. The bonding composition has a pH in the range from about 1.4 to about 2.2, and is substantially free of chromate ions, molybdate ions, and magnesium ions.
L'invention concerne une composition de liant par polymérisation à chaud pour fournir un revêtement à un substrat solide, ladite composition comprenant de l'eau, des ions de phosphate, des ions de borate et ions d'aluminum. La composition de liant présente un pH d'environ 1,4 à 2,2, et est sensiblement exempte d'ions de chrome, d'ions de molybdate et d'ions de magnésium.
Eddinger Kevin B.
Hughes John E.
Mosser Mark F.
Myers Ronald E.
Mccarthy Tetrault Llp
Sermatech International Inc.
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