Circuit arrangement comprising an integrated semiconductor...

Details Circuit arrangement comprising an integrated semiconductor... Circuit arrangement comprising an integrated semiconductor...

H - Electricity

01

L

356/23, 356/32

H01L 29/40 (2006.01) H01L 23/64 (2006.01) H03F 1/14 (2006.01) H03L 1/00 (2006.01) H05K 1/02 (2006.01)

Patent

CA 1183279

ABSTRACT: A circuit arrangement comprises an integrated semiconductor circuit in a casing with a plurality of connection leads A, B, C, in which stray capacitances with equal temperature coefficients exist between one connection lead and the two adjacent, second and third, connection leads and in which a voltage UBA is present between the first and second connection leads, which effect of this temperature-dependent current, a compensa- tion voltage UCB is applied between the first and second connection leads, which compensation voltage causes a current UCB which is equal and opposite to the current IBA through the stray capacitance between the first and second connection leads to flow through the stray capaci- tance between the first and third connection leads.

403898

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