Circuit arrangement for components to be cooled and...

Details Circuit arrangement for components to be cooled and... Circuit arrangement for components to be cooled and...

H - Electricity

01

L

H01L 23/36 (2006.01) H01L 23/433 (2006.01) H05K 1/02 (2006.01) H05K 7/20 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2459216

The invention proposes a simpler way of removing heat from integrated power components. For this purpose, a heat transfer device, in particular a thermally conducting mat (3), is inserted between the components (2) to be cooled and a core of an inductive component (4). The heat produced by the power semiconductors (2) can thus be dissipated to the core of the inductive component (4).

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