Circuit board adhesives for soldering environments

Details Circuit board adhesives for soldering environments Circuit board adhesives for soldering environments

C - Chemistry, Metallurgy

09

J

C09J 179/08 (2006.01) C08G 73/10 (2006.01) C09J 5/06 (2006.01) H01L 21/77 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2222053

Disclosed is a method of bonding integrated circuit chips to lead frames where the leads are later soldered. A solution of an adhesive polyimide is used. The polyimide is the reaction product of an aromatic dianhydride and a mixture of an aromatic diamine and an aliphatic diamine.

Méthode de connexion de puces à des réseaux de conducteurs, où les conducteurs en question sont par la suite soudés. On utilise à cette fin une solution constituée d'un polyimide adhésif. Ce polyimide est le produit d'une réaction entre un dianhydride aromatique et un mélange de diamine aromatique et de diamine aliphatique.

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