H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12
H05K 1/00 (2006.01) H05K 3/00 (2006.01) H05K 3/06 (2006.01) H05K 3/28 (2006.01) H05K 3/12 (2006.01) H05K 3/42 (2006.01)
Patent
CA 1130011
- 12 - CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR Abstract of the Disclosure An electrical circuit board is prepared by appli- cation, over a conductive foil which is supported on a substrate, of a hot-melt resin in accordance with the desired circuit pattern. The resin may be applied by screen printing and, after curing, will function as a resist coating for the conductive material during sub- sequent chemical removal of the foil from unprotected areas to form the individual conductors of the pattern. During subsequent connection of the circuit to other com- ponents contact areas on the individual conductors may be exposed by contacting the resin coating with molten solder.
330796
Rogers Corporation
Swabey Ogilvy Renault
LandOfFree
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