Circuit board and method of making

Details Circuit board and method of making Circuit board and method of making

H - Electricity

05

K

356/18

H05K 3/10 (2006.01) H05K 1/11 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1075825

ABSTRACT A circuit board comprising a dielectric insulating substrate molded in its finished form with a surface recessed to correspond to the desired circuitry, the recess being filled with conductive metal which is chemically and/or mechanically bonded to the surfaces of the recess. The substrate may be provided with holes filled or lined with conductive metal, and the surface of the circuit may be coated with protective materials, easily removable or otherwise. The process of making the board includes molding the board to its finished form, including a recess in one or more surfaces corresponding to the desired circuitry, with connecting holes if needed; treating the entire surface in preparation for plating; applying a plating resist to the raised land areas of the board; plating the board with copper or other conductive metal to the desired thickness (e.g., into the recess).

274360

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