Circuit board assembly and method of attaching a chip to a...

H - Electricity – 01 – Q

Patent

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Details

H01Q 21/00 (2006.01) H01L 23/00 (2006.01)

Patent

CA 2538100

An antenna array (100) is assembled by direct attaching a flip chip transmit/receive (T/R) module (1) to an antenna circuit board (2). A fillet bond (6) is applied to the circuit board (2) and the flip chip T/R module (1) around at least a portion of the periphery of the flip chip T/R module (1).

L'invention porte sur l'assemblage d'un réseau d'antennes (100) par fixation directe d'un module émetteur et/ou récepteur à connexion par billes (1) sur une plaquette de circuits imprimés pour antennes (2). On applique une soudure d'angle (6) sur le circuit imprimé (2) et le module émetteur et/ou récepteur à connexion par billes (1) sur au moins une partie du pourtour du module émetteur et/ou récepteur à connexion par billes (1).

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