Circuit board fabrication leading to increased capacity

Details Circuit board fabrication leading to increased capacity Circuit board fabrication leading to increased capacity

H - Electricity

05

K

356/12

H05K 1/02 (2006.01) G03F 7/00 (2006.01) H05K 1/00 (2006.01) H05K 3/00 (2006.01) H05K 3/46 (2006.01)

Patent

CA 1189630

CIRCUIT BOARD FABRICATION LEADING TO INCREASED CAPACITY Abstract Printed circuit boards having a plurality of circuit layers are produced using a specific processing sequence. A copper-clad substrate is first patterned in a desired configuration to produce the first layer of the printed circuit board. The patterned metallization is then covered with a specifically formulated energy sensitive material. The energy sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern. The entire substrate is blanket-cured to produce a rigid layer having openings in appropriate places. The openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

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