H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/42 (2006.01) H05K 1/05 (2006.01)
Patent
CA 2711649
A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
L'invention porte sur un procédé de fabrication d'une carte de circuit qui comprend les opérations consistant à : produire un substrat comprenant une première âme électriquement conductrice ayant un premier revêtement isolant sur un premier côté et un second revêtement isolant sur un second côté, former une ouverture dans les premier et second revêtements isolants et la première âme électriquement conductrice, exposer un bord de l'âme conductrice à l'intérieur de l'ouverture, et électrodéposer un troisième matériau isolant sur le bord exposé de la première âme électriquement conductrice. L'invention porte également sur une carte de circuit fabriquée à l'aide du procédé.
Olson Kevin C.
Pawlik Michael J.
Wang Alan E.
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
LandOfFree
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