Circuit board material

Details Circuit board material Circuit board material

H - Electricity

05

K

204/26

H05K 1/16 (2006.01) C23F 1/16 (2006.01) C25D 5/34 (2006.01) H01C 17/16 (2006.01)

Patent

CA 1312574

ABSTRACT OF INVENTION An improved multilayered circuit board material and process for making that material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer comprises electroplated nickel-phosphorus containing up to about 30% by weight of phosphorus; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.

527040

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