Circuit board, method for manufacturing same, and...

Details Circuit board, method for manufacturing same, and... Circuit board, method for manufacturing same, and...

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H01L 23/498 (2006.01) H05K 3/06 (2006.01) H05K 3/10 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2391223

A circuit board comprising a first metal layer 14 formed in patterns on a ceramic substrate 11, and a second metal layer 16 formed in patterns at least 0.5 µm thick on the first metal layer, wherein the first metal layer is reduced in width by etching. Also, a third metal layer 13 may be formed in patterns on the same plane as the first metal layer. The outermost surface of the second metal layer 16 is a metal such as gold that will not be etched. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high- output module by mounting at least one high-output semiconductor element thereon.

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