H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/14 (2006.01) H05K 7/16 (2006.01) H05K 7/18 (2006.01)
Patent
CA 2244816
A circuit board packaging structure, comprises: circuit boards each packaged with electric circuit parts and disposed in parallel to each other. The circuit board package with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on said other circuit boards is disposed outermost among the plurality of circuit boards. At the same time, it is disposed so that its surface exothermic quantity is directed to the outside. A cooling fan blows cooling air against said electric circuit parts exhibiting the larger exothermic quantity.
Cette invention concerne un montage de plaquettes à circuits intégrés sous boîtier comprenant plusieurs plaquettes à circuits intégrés disposées en parallèle. La plaquette à circuits intégrés dont les circuits dégagent le plus de chaleur est placé le plus près du boîtier, avec sa face chaude orientée vers l'extérieur. Un ventilateur de refroidissement souffle de l'air sur les circuits qui dégagent le plus de chaleur.
Ashida Takayuki
Fujita Shuuhei
Nakajima Hidenao
Otaguro Hiroyuki
Watanabe Yoshimi
Fetherstonhaugh & Co.
Fujitsu Limited
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