H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/3
H05K 7/20 (2006.01) H05K 1/02 (2006.01)
Patent
CA 1315013
Abstract Circuit Board with Cooling Device The amount of heat produced during operation of a printed circuit increases with the component density of the cir- cuit. This heat must be removed without causing any damage to the semiconductor components. It is often not sufficient to remove the heat by conduction through the circuit board or by convection. Additional cooling of the circuit board is then necessary. It is known, for example, to attach the circuit board to a hollow copper plate which is traversed by cooling channels. The production of such a copper plate is very complicated and costly. The idea of the invention is to design the circuit board itself as a cooling device. It consists of two outer layers (2) and at least one inner layer (4) which are united by an adhesive or by compression molding using a prepreg. Slots are formed in the inner layer (4) by milling, stamping or cutting. After attach- ment of the outer layers (2), these slots form channels (5) through which a coolant flows. (Fig. 1)
591614
Florjancic Matjaz
Richter Horst
Seibold Gerhard
Smernos Stauros
Thaidigsmann Otto
Alcatel N.v.
Smart & Biggar
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