Circuit board with mounted components and method for...

H - Electricity – 05 – K

Patent

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Details

347/34, 356/8

H05K 1/18 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1131746

ABSTRACT OF DISCLOSURE A circuit board having a conductor pattern fixed to one surface and having its opposite surface free of conductor patterns. Spaced perforations having metal walls extending through the circuit board and being connected to the conductor pattern at the one surface. At least one component mounted at the conductor pattern surface side of the circuit board and having component wires extending through the perforations and projection from the conductor pattern free surface of the board. A solder joint filling the space between the component wire and the metal hole wall and extending upwardly in the perforations from the conductor pattern free surface of the board and being substantially flush with such surface. The method of forming such board by heating the projecting ends of the conductor wires in a hot, molten solder bath and causing the hot metal to flow upwardly on the wire into the perforation.

322462

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