Circuit boards with die stamped contact pads and conductive...

Details Circuit boards with die stamped contact pads and conductive... Circuit boards with die stamped contact pads and conductive...

H - Electricity

05

K

356/12

H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/04 (2006.01) H05K 3/40 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1189631

CIRCUIT BOARDS WITH DIE STAMPED CONTACT PADS AND CONDUCTIVE INK CIRCUIT PATTERNS Abstract of the Disclosure Printed circuit boards have copper contact pads cut from copper foil and bonded to the circuit board, followed by printing circuit patterns of conductive ink on the board, the pattern connecting with the contact pads. The contact pads are cut from a copper foil strip fed with the circuit board beneath a die. Bonding of the contact pads follows, then printing of the circuit patterns. Boards can be formed from strip material in which case the individual boards are cut from the strip material. - i -

441235

Affiliated with

Also associated with

Rating

Circuit boards with die stamped contact pads and conductive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit boards with die stamped contact pads and conductive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit boards with die stamped contact pads and conductive... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1226612