Circuit device package assembly

Details Circuit device package assembly Circuit device package assembly

G - Physics

04

C

347/35

G04C 3/00 (2006.01) H05K 5/06 (2006.01)

Patent

CA 1067194

CIRCUIT DEVICE PACKAGE ASSEMBLY Abstract of the Disclosure The present invention relates to a package assembly for a magnetic bubble domain chip. The package is comprised of a metal lead frame and a magnetic bubble domain chip mounted in a rectangular region of the frame. The chip is provided with a plurality of electrical contacts, at least some of which are interconnected to electrical conductors of the frame to allow selective actuation of a plurality of magnetic bubble domain functions. The chip and frame are encapsulated by a body of insulating material. The electrical conductors extend from the body and are connected to pins. A unit for providing selectively energizable in-plane magnetic field is provided for the chip and includes first and second field coils respectively encircling the body and arranged in orthogonal relation to each other. A permanent magnet is mounted on opposite ends of the body in spaced relation to the coils. Magnetic field spreader members are provided, made of magnetic material. They are mounted on opposite major surfaces of the body in spaced relation to the coils. The magnetic spreader members engage the permanent magnet and define therewith a magnetic enclosure for the encapsulated chip.

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