Circuit device packaging technique

Details Circuit device packaging technique Circuit device packaging technique

G - Physics

04

C

58/11, 347/35

G04C 17/00 (2006.01) G04G 17/02 (2006.01) H01L 23/495 (2006.01) H05K 5/06 (2006.01)

Patent

CA 1058312

CIRCUIT DEVICE PACKAGING TECHNIQUE Abstract of the Disclosure The package of a circuit device such as an integrated semiconductor circuit device is molded into a special shape to fit its function. The package includes leads extending from the circuit device to selected positions for interconnection both inside and outside the volume of the package such as for switch points or attachment of other electrical components to the circuit device. Support members or cavities are simultane- ously molded directly into the package for the mechanical support of the other electrical, magnetic, optical or optoelectronic components. Also, optical elements such as lenses or filters may be molded directly into the package to carry out optical functions.

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