G - Physics – 01 – R
Patent
G - Physics
01
R
324/58.1
G01R 31/28 (2006.01) G01R 1/18 (2006.01) G01R 27/28 (2006.01)
Patent
CA 1292513
ABSTRACT OF THE DISCLOSURE A circuit for measuring the dynamic charac- teristics of encapsulating packages for high-speed integrated circuits includes at least two amplifiers integrated on a semiconductor substrate. These amplifiers have the same input and output impedances as those of the high-speed circuit to be encapsulated within the package. The amplifiers are located in widely spaced relation in order to ensure that there is no internal coupling. Depending on the measurements to be performed, the two amplifiers are mounted in parallel or in antiparallel relation. In order to measure the dynamic characteristics of a package, a measuring circuit is mounted within a package and a signal (Ve) is addressed-to an input connection of the package. The transmission and coupling coefficients are deduced from measurement of the signal (VS) collected on an output connection.
552019
Gloanec Maurice
Jarry Jacques-Jean
Lailler Jean-Luc
Gloanec Maurice
Goudreau Gage Dubuc
Jarry Jacques-Jean
Lailler Jean-Luc
Thomson Hybrides Et Microondes
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