Circuit formation by laser ablation of ink

Details Circuit formation by laser ablation of ink Circuit formation by laser ablation of ink

H - Electricity

05

K

H05K 3/02 (2006.01) H01L 21/48 (2006.01) H01L 21/70 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2469463

There is disclosed a method of forming conductive tracks on a substrate using a laser ablation technique in order to produce Printed Circuit Boards (PCBs). The method involves the initial step of coating a substrate such as alumina substrate (16) with a conductive ink to create a conductive ink layer (20). Subsequent to this, a laser spot (24) is focussed onto the ink (20) in order to ablate a portion of the ink layer (20) from the substrate (16) to define tracks of ink (32), which are then cured. Also disclosed is a method of forming multiple layers of conductive tracks on a substrate, each layer of conductive tracks being separated by a layer of cured dielectric ink. The method involves and sequentially coating, ablating, and curing alternate dielectric and conductive ink layers on a substrate incorporating cured tracks of ink produced by the method noted above. An apparatus for use in the method is also disclosed.

L'invention concerne un procédé de formation de pistes conductrices sur un substrat au moyen d'une technique d'ablation laser visant à fabriquer des cartes de circuits imprimés (PCB). Ce procédé consiste d'abord à enduire un substrat, tel qu'un substrat d'alumine (16), d'une pâte conductrice pour former une couche de pâte conductrice (20) ; à diriger ensuite une tâche laser (24) sur la pâte (20) pour ablater une partie de la couche de pâte (20) du substrat (16) et former ainsi des pistes de pâte (32) ; et enfin, à soumettre ces pistes à la cuisson. Par ailleurs, l'invention concerne un procédé de formation, sur un substrat, de multiples couches de pistes conductrices séparées chacune par une couche de pâte diélectrique cuite. Ce procédé consiste à enduire, ablater et cuire successivement des couches de pâte diélectriques et conductrices alternées sur un substrat comportant des pistes de pâtes cuites obtenues par ledit procédé. L'invention concerne également un appareil utilisé dans ce procédé.

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