Circuit module system and method

Details Circuit module system and method Circuit module system and method

H - Electricity

05

K

H05K 1/00 (2006.01) H01L 23/36 (2006.01) H05K 1/14 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2515714

Flexible circuitry is populated with integrated circuits (ICs) disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.

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