Circuit module with enhanced heat transfer and distribution

Details Circuit module with enhanced heat transfer and distribution Circuit module with enhanced heat transfer and distribution

H - Electricity

05

K

356/3, 347/36

H05K 1/02 (2006.01) H01L 23/36 (2006.01) H05K 7/20 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1210519

ABSTRACT A circuit module having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module includes a circuit board assembly with a plurality of electronic devices such as integrated circuits, mounted on a circuit board. The circuit board includes conductive pads and plated-through holes forming a thermal- ly conductive flow path from each electronic device to the opposite side of the circuit board for more efficient heat transfer away from the module. The heat pads and plated-through holes are preferably connected with the ground plane layer of the circuit board for better heat distribution as well.

452415

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