Circuit pack cooling using perforations

Details Circuit pack cooling using perforations Circuit pack cooling using perforations

H - Electricity

05

K

H05K 7/20 (2006.01) H01L 23/467 (2006.01) H05K 1/14 (2006.01)

Patent

CA 2041461

Disclosed is an apparatus for providing forced air cooling of components mounted on circuit boards in a stacked configuration. A plurality of perforations is provided in the circuit boards so that air flow in the channel between boards causes air to be sucked through the perforations to eliminate stagnant areas between components and provide local jet impingement cooling.

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