Circuit pack with integrated closed loop cooling system

Details Circuit pack with integrated closed loop cooling system Circuit pack with integrated closed loop cooling system

H - Electricity

01

L

H01L 23/46 (2006.01) H01L 23/467 (2006.01) H01L 23/473 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2161823

11 A circuit pack with an integrated closed loop cooling system, the circuit pack comprising: a substrate; at least one heat-producing component mounted on the substrate; cooling units provided for predetermined ones of at least one heat-producing component in heat conductive relationship therewith; a delivery system for delivery of a cooling fluid to and from the cooling units; and a cooling fluid mover coupled to the substrate for circulating the cooling fluid through the delivery system and the cooling units. In an illustrative example of the invention, a heat exchanger and cooling fluid reservoir are coupled to the delivery system to enhance the performance of the integrated closed-loop cooling system in certain applications of the invention.

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