Circuit package handling apparatus

Details Circuit package handling apparatus Circuit package handling apparatus

B - Operations, Transporting

23

P

26/14

B23P 19/00 (2006.01) H05K 13/02 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1168840

ABSTRACT Apparatus is provided for rapidly and simultaneously inserting electronic circuit packages into sockets on burn- in boards. A quantity of dual in-line packages (DIPs) is placed in registry with an equal number of sockets on a burn- in board, and the pins are inserted into the sockets. How- ever, the pressure applied to each DIP during insertion into the burn-in board is limited, so that no damage can be done to a DIP on which the leads are not in registry with the sockets. Thus, if a bent lead prevents proper insertion of the DIP into the socket, the DIP is not damaged, nor is the bent pin further damaged.

388216

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