H - Electricity – 05 – B
Patent
H - Electricity
05
B
H05B 3/20 (2006.01) H01L 21/00 (2006.01) H05B 3/14 (2006.01) H05B 3/28 (2006.01)
Patent
CA 2381597
A technology that achieves a highly uniform temperature distribution on the surface of large-area semiconductor wafers and substrates for liquid crystals without prior measurement of the resistance-heating-element circuit and subsequent adjustment of the value of resistance. At least one current- receiving point 4 and at least one current-releasing point 5 are provided at the central portion of an insulating substrate 1. One or more resistance-heating-element circuits 2 are embedded in the insulating substrate spirally or pseudospirally from the central portion including the current-receiving point 4 to the peripheral portion of the insulating substrate 1. All the circuits merge with one another at the outermost portion. One or more resistance-heating-element circuits are separated at the outermost portion of the resistance-heating-element circuits and are formed spirally or pseudospirally from the outermost portion to the central portion including the current-releasing point 5.
Kuibira Akira
Nakata Hirohiko
Narita Masashi
Natsuhara Masuhiro
Marks & Clerk
Sumitomo Electric Industries Ltd.
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