Circuitized substrate assembly and method of making same

Details Circuitized substrate assembly and method of making same Circuitized substrate assembly and method of making same

H - Electricity

05

K

H05K 1/00 (2006.01) H05K 3/46 (2006.01) H05K 3/32 (2006.01) H01R 12/06 (2006.01)

Patent

CA 2452178

A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

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