Cladding material

Details Cladding material Cladding material

H - Electricity

01

M

H01M 2/12 (2006.01) B23K 20/04 (2006.01)

Patent

CA 2246571

Clad material comprises a metal substrate which is provided with a multiplicity of perforated openings therein and a metal foil which is laminated on the metal substrate to close the perforated openings. To produce such a clad material, at least one surface of the metal substrate and corresponding one surface of the metal foil are respectively subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surfaces face each other. Alternately, only one surface of the metal substrate is subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surface of the metal substrate defines a laminating surface. It may be possible to provide a nickel plating on the metal substrate or the metal foil. The clad material can be effectively used for producing safety valve chips which rupture accurately at low pressures which fall in a stable pressure range on a mass production basis.

L'invention concerne un matériau de placage qui éclate avec précision à une température prédéterminée de façon à libérer une pression interne, qui est facile à fabriquer et qui est utilisé pour des soupapes de sécurité. Le matériau de placage (19) comprend un substrat métallique (20A) comportant une pluralité de trous traversants (C) et une feuille métallique (20B) laminée sur le substrat métallique (20A), de façon à fermer les trous traversants (C).

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