C - Chemistry – Metallurgy – 23 – G
Patent
C - Chemistry, Metallurgy
23
G
356/1, 149/25
C23G 5/024 (2006.01) C11D 3/18 (2006.01) C11D 3/43 (2006.01) C11D 7/50 (2006.01) C11D 7/24 (2006.01) H05K 3/26 (2006.01)
Patent
CA 2024589
ABSTRACT OF THE DISCLOSURE A cleaning composition which comprises dimethylcyclo- octadiences is disclosed. there is further disclosed a method of cleaning printed circuit boards or printed wiring boards, which comprises: contacting the board with a composition comprising diemthylcyclooctadienes and 2-20 % by weight of a surfactant; rinsing the board with water; and drying board.
Horii Hideo
Horiuchi Yoshiaki
Kumagai Noriaki
Omura Katsumi
Shiozu Shinichiro
Fetherstonhaugh & Co.
Kuraray Co. Ltd.
Nagase & Company Ltd.
LandOfFree
Cleaning compositions and applications thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cleaning compositions and applications thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cleaning compositions and applications thereof will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1621624