Cluster packaging of light emitting diodes

Details Cluster packaging of light emitting diodes Cluster packaging of light emitting diodes

H - Electricity

01

L

H01L 27/15 (2006.01) H01L 21/78 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2473722

Methods of forming a light emitting diode are provided by scoring a semiconductor substrate having a light emitting region formed thereon so as to provide score lines between individual ones of a plurality of light emitting diodes. The semiconductor substrate is then broken along selected ones of the score lines so as to provide a unitized subset of the plurality of light emitting diodes. The unitized subset includes at least two light emitting diodes. Electrical connections are provided to the light emitting diodes of the unitized subset of the plurality of light emitting diodes. The score lines may also define the individual ones of the light emitting diodes.

L'invention a trait à des procédés de formation d'une diode électroluminescente, consistant à rainurer un substrat semi-conducteur sur lequel est formée une zone électroluminescente, afin d'obtenir des lignes de coupe entre certaines diodes d'une pluralité de diodes électroluminescentes. Le substrat semi-conducteur est ensuite fragmenté le long de certaines lignes de coupe sélectionnées, afin que l'on obtienne un sous-ensemble de la pluralité de diodes électroluminescentes formant une unité. Le sous-ensemble formant une unité comprend au moins deux diodes électroluminescentes. Les diodes électroluminescentes du sous-ensemble de la pluralité de diodes électroluminescentes formant une unité sont pourvues de liaisons électriques. Les lignes de coupe peuvent également définir des diodes particulières de la pluralité de diodes électroluminescentes.

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