Coating substrate

H - Electricity – 01 – L

Patent

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Details

H01L 31/00 (2006.01) C22C 21/00 (2006.01) C22F 1/04 (2006.01) C23C 16/02 (2006.01) H01L 31/0392 (2006.01) H01L 31/052 (2006.01)

Patent

CA 2250535

The invention concerns a coating substrate containing an aluminium or aluminium alloy rolled product for thin-film coatings for producing electronic components. The coating substrate prevents the interdiffusion of substrate elements and thin-film coating elements and enables the thin-film coatings to grow completely over irregularities. The local irregularities on the substrate surface to be coated, which have a maximum extension, measured vertically to the substrate surface, of less than 10 µm and more than 0.1 µm, are such that the flanks of the local irregularities can be exposed completely to material deposition impinging on the substrate surface in a perpendicular manner.

L'invention concerne un substrat de revêtement contenant un produit laminé composé d'aluminium ou d'alliages d'aluminium, pour revêtements de fines pellicules pour produire des composants électroniques. Le substrat de revêtement empêche l'interdiffusion d'éléments du substrat et d'éléments de revêtement de fines pellicules et permet aux revêtements de fines pellicules de recouvrir entièrement des aspérités. Les aspérités présentes localement sur la surface du substrat à recouvrir, dont l'extension maximale mesurée perpendiculairement à la surface du substrat est inférieure à 10 mu m et supérieure à 0,1 mu m, se présentent de manière que les flancs des aspérités locales puissent être exposés pleinement à un dépôt du matériau intervenant perpendiculairement sur la surface du substrat.

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