C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/56 (2006.01) C25D 3/62 (2006.01)
Patent
CA 2268867
A relatively stable, weakly acidic, non-cyanide electroplating solution for deposition of Au-Sn alloys over a range of compositions. The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and L- ascorbic acid as stabilizers. Preliminary electroplating experiments with the developed solution indicate that uniform, homogeneous deposits can be achieved over a range of compositions, including the technologically important eutectic and near euctectic values.
Ivey Douglas Gordon
Sun I. Wenzhen
Rowley C.a.
The Governors Of The University Of Alberta
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