H - Electricity
05
K
356/13, 179/31,
H05K 1/16 (2006.01) H01F 17/00 (2006.01)
Patent
CA 1145425
ABSTRACT OF THE DISCLOSURE A coil assembly comprises a plurality of conductive spiral pattern layers which are piled up via (an) insulating layer(s) on a wafer. The electrical connection between the spiral patterns is established by means of a conductive member, which is a portion of the upper spiral pattern layer, filled in a through-hole which is made in the insulating layer so that the spiral patterns are connected in series to develop a high voltage when the coil assembly is moved in a magnetic field.
335347
Akiyama Naoki
Konno Toshio
Kubo Susumu
Matsuda Norio
Mori Yasuyuki
Gowling Lafleur Henderson Llp
Victor Company Of Japan Limited
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