C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
13/16, 204/19, 2
C25D 5/10 (2006.01) B32B 15/01 (2006.01) B32B 15/02 (2006.01) B32B 15/18 (2006.01) C25D 5/12 (2006.01) C25D 5/18 (2006.01) C25D 5/36 (2006.01) C25D 5/50 (2006.01)
Patent
CA 2019568
This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. Preferably an outer layer of nickel is applied, also at an initial low current density , followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.
Cette invention concerne une méthode de fabrication de flans de monnaie plaqués et articles analogues éliminant les défauts comme les piqûres et les cloques. Un flan en métal ferreux est nickelé en bain électrolytique d'amorçage, puis revêtu de cuivre appliqué à une densité de courant initiale faible suivie d'une densité de courant maximale pour minimiser la formation de ponts. De préférence, une autre couche de nickel est déposée également à densité de courant initiale faible suivie d'une densité de courant maximale. Il est préférable de procéder à un recuit avant ou après l'application de la couche finale de nickel. Cette invention concerne les flans et pièces de monnaie ainsi obtenus.
Dilay Maria
Truong Hieu C.
Gowling Lafleur Henderson Llp
Royal Canadian Mint
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