Cold-plasma treatment of seeds to remove surface materials

Details Cold-plasma treatment of seeds to remove surface materials Cold-plasma treatment of seeds to remove surface materials

A - Human Necessities

01

C

A01C 1/00 (2006.01) A01C 1/08 (2006.01) B08B 7/00 (2006.01)

Patent

CA 2377268

Seeds are treated in a cold plasma in a reaction chamber to etch the surface of the seeds to remove surface materials, such as fungicides and insecticides, or to disinfect the surfaces. The cold plasma process is carried out using etch gases which do not harm the seeds and for selected periods of time sufficient to remove surface materials without necessarily affecting the viability of live seeds after treatment. Tumbling the seeds while exposing the seeds to the plasma allows the surfaces of the seeds to be etched uniformly.

L'invention concerne des cristaux germes traités dans un plasma froid dans une chambre de réaction afin de soumettre la surface des cristaux germes à une attaque chimique pour éliminer les matières de surface, telles que les fongicides et les insecticides ou pour désinfecter les surfaces. Le traitement au plasma froid est effectué à l'aide de gaz pour l'attaque chimique n'endommageant pas les cristaux germes pendant des périodes sélectionnées qui durent suffisamment pour éliminer les matières de surface sans pour autant affecter la viabilité des cristaux germes vivants après traitement. Le polissage des cristaux germes exposés au plasma permet de soumettre les surfaces des cristaux germes à une attaque chimique uniforme.

Affiliated with

Also associated with

Rating

Cold-plasma treatment of seeds to remove surface materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cold-plasma treatment of seeds to remove surface materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cold-plasma treatment of seeds to remove surface materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1541181