C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
154/118, 400/922
C08K 3/38 (2006.01) B31F 1/28 (2006.01) B32B 3/28 (2006.01) C08K 5/55 (2006.01) C08L 29/04 (2006.01) C09J 129/04 (2006.01) D21H 27/40 (2006.01)
Patent
CA 1185031
ABSTRACT OF THE DISCLOSURE Adhesives prepared by dissolving polyvinyl alcohol, a filler and a water-soluble boron compound in water arc described. These adhesives are "cold-set" adhesives which are liquid at a temperature of 60°C or more, but lose their fluidity to gelatinize on cooling at a temperature higher than 20°C, they are very useful for a cold corrugation system.
364420
Hirai Kiyoshi
Murano Itaru
Suenaga Junichi
Sumi Masao
Takenaka Masazo
George H. Riches And Associates
Okayama Paper Mill Co. Ltd.
Unitika Ltd.
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